This product is the module for expansion (device module) which expands a reed relay junction output interface for various controllers. It is used connecting for I/O controller module CPU-CAxx(FIT)GY of F&eIT series, and microcontroller unit CPU-SBxx(FIT)GY. The relay output of a maximum of four points can be performed by one module.
Certification
CE
Environmental
Lead-Free
Features
- The independent common reed relay junction output of four points can be performed.
- Output rating is designed by the large scale of a maximum of 125VAC/30VDC and 2A per point.
- Device ID can be set up with a rotary switch and apparatus number management can be performed easily.
- This module is equipped with 35mmDIN rail attachment mechanism as standard like other F&eIT series products. Moreover, the connection with a controller module can constitute a system simply and smartly without using connection apparatus, such as a backplane board, since it has unique composition which carries out a stack connection on the side.
Specification
F&eIT
Product function / Classification Device module
Digital I/O
Response speed 7msec(max.)
Operation voltage Output: --125VAC / --30VDC
Output circuit Lead relay point-of-contact output
I/O module
Function Digital I/O Module
Support Head Module Remote I/O [CPU-CA10]
Support Head Module Remote I/O [CPU-CA20]
Support Head Module Microcontroller [CPU-SB10]
Support Head Module Microcontroller [CPU-SB20]
Support Head Module Microcontroller [CPU-SB30]
Support Head Module Monitoring & Control [SVR-MMF2]
Options
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